Wafer cutting system for cream-filled wafers

In high-capacity wafer production environments, achieving precision cuts in filled wafers can be challenging. Variations in cutting speed and accuracy can lead to inconsistent product quality and operational inefficiencies.

Ensures precise cuts for filled wafers

The Hebenstreit Wafer Cutting System WD XX is a fully automatic solution for cutting cream, caramel, or jam-filled flat and hollow wafers. Utilizing two independent servo drives for the first and second cuts, the system allows for optimized speed settings on each cutting carriage, ensuring precise and consistent results. Designed for high-capacity production lines, it supports up to 20 cuts per minute, enhancing efficiency and throughput. The innovative machine concept ensures seamless integration into existing processes and guarantees uninterrupted production. The equipment is manufactured by Hebenstreit GmbH, a company known for its durable and reliable industrial food processing solutions. The system excels in wafer and snack production environments, where precision and high output are essential.

Benefits

  • High capacity with up to 20 cuts per minute
  • Independent speed optimization for each cutting carriage
  • Consistent and precise cutting for filled wafers
  • Fully automatic operation for continuous production
  • Seamless integration into existing processes

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