Wafer row discharge device for feeding packing machines
In the wafer production industry, ensuring the efficient and gentle discharge of wafer rows into packing machines is crucial. Traditional methods often risk damaging the delicate wafer layers or cause interruptions in the production line, leading to inefficiencies.
Automate wafer discharge to packing lines
The Wafer Discharge Device WEP by Hebenstreit is designed to automatically feed cut wafer rows into one or more packing machines. It can handle single or double rows of wafers and can discharge them to the left, right, or both sides. This device is unique for its gentle handling of wafers, ensuring the rows are separated cleanly before discharge. Capable of up to 45 discharges per minute, it adapts to various product types, stack heights, and dimensions. Hebenstreit’s device operates methodically to minimize product damage and ensures a smooth and continuous feed, supporting high-efficiency packing routines.
Benefits
- Automatic feeding reduces manual intervention
- Gentle handling prevents wafer damage
- Adapts to different product dimensions
- Supports high-speed operations with up to 45 discharges per minute
- Versatile discharge directions for flexibility