Low-flow vaporizer for precise chemical vapor deposition
Ensure stable and precise vapor control for low-flow applications, enhancing the efficiency and consistency of your continuous vaporization processes.
Delivers Consistent Vapor Concentrations for Low-Flow Applications
The Low-Flow Turbo II Vaporizer 2852NP, part of the MSP Turbo™ series, is engineered to deliver stable vapor concentrations crucial for semiconductor and chemical industry applications. Designed for low-flow operations, it integrates seamlessly into continuous processing lines, offering flexibility with various liquid flow controllers. The vaporizer employs a robust heater system capable of temperatures ranging from 180°C to 340°C, ensuring precise control over vaporization processes.
With fittings compatible for inert gas and standard pressure operations, the 2852NP adapts to diverse production environments while maintaining a compact form factor (198 mm x 79 mm x 114 mm) and a manageable weight of 2.5 kg. Constructed with corrosion-resistant materials like SS 316, PEEK, and PTFE, it promises durability in demanding chemical contexts. Featuring a liquid shut-off valve, the vaporizer ensures safety and efficiency, ideal for research laboratories and advanced materials producers needing reliable vapor delivery solutions. The unit is engineered to handle a maximum carrier gas flow of 12.0 standard liters per minute and a liquid flow of up to 27 g/min, dependent on the carrier gas and vapor pressures used.
Benefits
- Ensures stable vapor delivery, enhancing process reliability in semiconductor and chemical production.
- Compact design minimizes space requirements in production facilities.
- Reduces maintenance costs with a low-maintenance design and durable construction materials.
- Enables precise temperature control for accurate vaporization, crucial for sensitive applications.
- Supports flexible integration with various liquid flow controllers, increasing adaptability to existing systems.
- Applications
- End products
- Steps before
- Purification,Precursor Mixing,Flow Rate Calibration
- Steps after
- Thin Film Deposition,Coating,CVD Process
- Input ingredients
- carrier gas,inert gas,liquid (TEOS or equivalent),compressed air
- Output ingredients
- vapor,stable vapor concentrations
- Market info
- Dimensions
- 198 mm x 79 mm x 114 mm (7.8 inch x 3.1 inch x 4.5 inch)
- Weight
- 2.5 kg (5.6 lb)
- Fittings - Carrier Gas Inlet
- 1/4 in. VCR female split nut
- Fittings - Liquid Inlet
- 1/8 in. VCR female
- Fittings - Vapor Outlet
- 1/4 in. VCR female split nut
- Fittings - Compressed Air
- 4 mm instant tube fitting
- Wetted Parts
- SS 316,PEEK,PTFE,Elgiloy®,FFKM
- Leak Integrity
- ≤ 1x 10⁻⁸Pa·m³/s Helium
- Heater Power Requirements
- 1208 VAC,60 Hz,450 W
- Recommended Carrier Gas
- Inert gas
- Max Carrier Gas Flow
- 12.0 standard liters/min N2@ 50 psig
- Max Liquid Flow
- 27 g/min (TEOS or equivalent)
- System Pressure Limit
- 150 psig
- Compressed Air Pressure
- 90 to 110 psig
- Temperature Range
- 340°C to 180°C
- Temperature Sensor
- 2 type Ƙ thermocouples
- Vapor flow rate
- Low to mid
- Liquid control
- Integrated liquid shut-off valve
- Footprint
- Small
- Temperature control
- 340°C to 180°C
- Automation level
- Compatible with integrated flow control valve systems
- Density/particle size
- 0.5–2.5 g/cm³ / 50–1000 µm
- Carrier Gas Compatibility
- Inert gas
- Dimensions
- 198 mm x 79 mm x 114 mm (7.8 inch x 3.1 inch x 4.5 inch)
- Weight
- 2.5 kg (5.6 lb)
- Fittings
- Carrier Gas Inlet 1/4 in. VCR female split nut,Liquid Inlet 1/8 in. VCR female,Vapor Outlet 1/4 in. VCR female split nut,Compressed Air 4 mm instant tube fitting
- Wetted Parts Material
- SS 316,PEEK,PTFE,Elgiloy®,FFKM
- Compact footprint
- Very small