Low-flow vaporizer for precise chemical vapor deposition
In advanced semiconductor manufacturing, ensuring stable vapor concentration is essential for optimal thin film deposition. This requires precise control over vapor flow, temperature, and liquid feed to avoid film defects and ensure uniform layer formation.
Ensures stable vapor concentration for Cvd applications
The Low-Flow Turbo II Vaporizer 2852NP by TSI Systems is designed for applications that demand low to mid vapor flow rates. This vaporizer ensures stable vapor concentrations while maintaining a compact design, making it suitable for environments with space constraints. It features a liquid shut-off valve and is compatible with various liquid flow controllers with integrated flow control valves. The unit supports inert carrier gases and operates efficiently within a temperature range of 40°C to 180°C. Key components include SS 316, PEEK, PTFE, Elgiloy®, and FFKM, ensuring longevity and resistance to corrosion. Suitable for use in semiconductor manufacturing, this vaporizer provides reliable performance with a maximum carrier gas flow of 2.0 standard liters per minute at 50 psig and a maximum liquid flow of 7 g/min. The system pressure limit is 150 psig, and it requires compressed air between 90 to 110 psig.
Benefits
- Compact design suitable for space-constrained environments
- Stable vapor concentration for precise thin film deposition
- Compatibility with various liquid flow controllers
- Robust construction with corrosion-resistant materials
- Wide temperature operation range (40°C to 180°C)