Automated 10nm particle deposition system for semiconductor wafers
In semiconductor manufacturing, precisely calibrating defect inspection tools is critical to maintaining product yield and ensuring high quality. Dealing with the challenge of reliably depositing nanoparticles as small as 10 nm requires advanced technology.
Automated particle deposition for semiconductor wafer calibration
The Auto-Load 2300G3A Particle Deposition System from TSI Systems is a fully automated solution designed for depositing PSL and SiO2 spheres on semiconductor wafers. This system uses advanced particle generation and Differential Mobility Analyzer (DMA) technology to control particle size with sub-nanometer repeatability, making it ideal for demanding metrology applications. It can process up to 25 wafers in a single job, thanks to robotic wafer handling, increasing productivity in your metrology operations. With a capacity for 16 particle suspensions and an operating range from 10 nm to 2 µm, it accommodates a wide array of inspection tool calibration needs. The system supports various deposit patterns such as full blanket, spot, arc, and ring, and generates high-quality contamination standards for 300 mm and 200 mm wafers.
Benefits
- Increases productivity with robotic wafer handling
- Ensures sub-nanometer repeatability in particle size
- Supports a wide range of deposit patterns
- Reduces time and effort for semiconductor calibration
- Wide operating range accommodates various calibration needs