20 nm particle deposition system for semiconductors
In semiconductor manufacturing, precise calibration and qualification of defect inspection tools are crucial. Traditional methods often lack the consistency and accuracy required, leading to inefficiencies and potential defects during production. The need for high-quality contamination standards and accurate particle deposition is paramount.
Deposits precise 20 nm particles for calibration
The Model 2300G3M Particle Deposition System by TSI Systems delivers best-in-class performance for depositing particle size standards on various wafer types. Utilizing advanced particle generation and Differential Mobility Analyzer (DMA) technology, the system controls the modal diameter of deposited particles with sub-nanometer repeatability and SI traceability. Capable of handling 16 particle suspensions, it operates within a DMA-mode range of 20 nm to 2 µm, allowing you to generate any inspection tool calibration curve through a single automated recipe. The system supports manual loading for a variety of substrates, including 150 mm, 200 mm, and 300 mm wafers, making it versatile for numerous metrology applications in the semiconductor industry.
Benefits
- Ensures high precision with sub-nanometer repeatability
- Manual loading supports diverse wafer sizes
- Handles multiple particle suspensions
- Enables creation of custom contamination standards
- Automated recipe control for consistent results